Send us your requirements: a spec sheet, a sketch, a paper you want to reproduce. We turn them into a mask layout and a process flow, then fabricate and inspect the devices. Need just one step, like a thin film on your own substrates? We do that too.
Hand us the whole problem, or just the step you cannot run yourself.
For teams with a device idea but no layout, no process flow, or no cleanroom access. You tell us what the chip has to do. We take it from there.
Already know exactly what you need? Send your substrates and a recipe, or tell us the film you want and we will recommend one.
Nothing goes into the cleanroom until you have approved the design.
Send whatever you have: specs, a sketch, target materials, a reference paper.
We review the request, flag the risks and send a quote with a timeline.
We draw the layout and the process flow, and you approve both before we start.
We run the process and update you after each major step.
You receive the chips with inspection images and measurement data.
Every in-house process is available on its own or as part of a full prototype run.
| Process | Methods | Typical requests |
|---|---|---|
| Thin-film deposition | Sputtering, e-beam and thermal evaporation, ALD, PECVD | Metal contacts, dielectric layers, optical coatings, seed layers |
| Lithography | Photolithography, direct-write, e-beam lithography | Electrodes, microfluidic channels, sub-micron features |
| Etching | Dry etching (RIE, ICP) and wet etching | Pattern transfer, trenches, membrane and structure release |
| Thermal and surface | Rapid thermal and furnace annealing, plasma cleaning | Contact annealing, film crystallization, surface preparation |
| Imaging and metrology | SEM, AFM, profilometry, ellipsometry, electrical test | Film thickness, feature dimensions, device characterization |
| Dicing and packaging
Via partner facility, quoted per project
|
Wafer dicing, wire bonding, chip mounting | Singulated dies, test-ready packaged devices |
Most projects start without a finished design. The more of this list you can share, the faster we can quote, but none of it is required to start the conversation.
We reply within 24 hours. Once a project is contracted, we sign an NDA and an intellectual-property agreement with you.